In the largest single foreign investment in US history, Taiwan Semiconductor Manufacturing Company has unveiled a $100 billion investment, drawing global attention and prompting concern in Taiwan.

Taiwan Semiconductor Manufacturing Company TSM, also known as TSMC, is expanding beyond wafer fabrication by investing heavily in advanced packaging technology. This segment is becoming critical as AI ...

In recent years, advanced packaging has become much more important. While semiconductor manufacturers used to focus primarily on miniaturization and increasing the performance of individual chips, the ...

Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology.

Amkor Technology's advanced packaging leadership and partnership with TSMC are key growth drivers, targeting a $37 per share price within a year. AMKR's expansion in Korea, Vietnam, and a new facility ...

For years, the semiconductor industry's great anxiety was silicon: whether foundries could shrink transistors fast enough, manufacture wafers in sufficient volume, and keep pace with the exponential ...

Advanced semiconductor packaging has become a central technology platform for high performance computing. For AI and HPC processors, performance depends not only on transistor density, but also on ...

Advanced packaging is no longer operating behind the scenes. The technology of advanced packaging is helping to sustain the speed of the semiconductor industry’s improvement in power and performance, ...

ASE Technology remains well-positioned to benefit from persistent advanced packaging bottlenecks, especially as TSMC’s capacity expansion still lags demand. ASX’s diversified customer base and rapid ...

This voice experience is generated by AI. Learn more. This voice experience is generated by AI. Learn more. Ever since former Intel CEO Pat Gelsinger announced in 2021 that Intel was entering the ...