Semiconductor machinery manufacturer Applied Materials (NASDAQ:AMAT) announced in Q2 CY2026, with sales up 24.8% year on year ...

Discover how Intel is enhancing its AI capabilities through innovative chip packaging technologies in New Mexico, positioning ...

TSMC is developing an EMIB-like chip packaging to rival Intel’s EMIB, easing AI chip bottlenecks for Nvidia/AMD.

Kulicke and Soffa (KLIC) rated Buy with $114 target. Explore advanced packaging growth, FY26–27 bonding revenue outlook, key risks. See more here.

Cadence believes the next level of AI-assisted engineering resides at the system level, and to that end, the company just announced its new AuraStack AI Super Agent.

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In a new report from Ctee, we're learning that demand for TSMC's advanced packaging "remains high" and that rumors across the semiconductor supply chain suggest TSMC plans to consider setting up CoWoS ...

As packages get larger and thinner, warpage is becoming a process-control problem rather than a simple flatness spec.

Last month, Intel boosted its capital expenditure forecast for the year from $18 billion to more than $20 billion. Chief ...